Novel packaging solutions for GaN power electronics: Silver-diamond composite packages
نویسندگان
چکیده
We present a new packaging solution for GaN power electronics for efficient heat extraction needed for high power devices. The benefits of using silver diamond composite as base plate in packages for GaN power bars is demonstrated. A dramatic improvement in thermal management (as high as ~50%) was obtained with respect to the existing packaging technologies based on CuW. Micro-Raman thermography measurements were carried out to determine the device temperature at a range of operating power levels. A finite element thermal model was built to assert the obtained experimental results and was found to be in good agreement.
منابع مشابه
Improved thermal management for GaN power electronics: Silver diamond composite packages
A novel packaging solution for GaN power electronics for efficient heat extraction in high power devices is presented. The benefits of using silver diamond composites as base plate in packages for GaN power bars are demonstrated. Micro-Raman thermography measurements were carried out to probe the device temperature for devices mounted on different base plates, silver diamond composites and stan...
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